PIC-024
Photonic Integrated Circuits & Photonic Test
PhotoBattery can define, execute, and validate this work as a measurable engineering engagement - from specification freeze and method selection through evidence review, acceptance testing, and decision-ready recommendations.
Photonic Flip-Chip Die Attach & Micro-Bump Integration is a structured engineering service for organizations that need a defined technical answer, a validated process or test path, and evidence suitable for the next design, qualification, or investment decision. The work can address bump architecture; die-placement accuracy; solder or thermo-compression bonding; coplanarity assessment; underfill strategy; electrical continuity. PhotoBattery selects and applies FDTD/FEM photonic solvers; foundry PDK/GDS workflow; tunable laser; optical spectrum analyzer; wafer-level optical probe; 6-axis nanopositioning stages, then evaluates the result against insertion/coupling loss budget met; spectral or RF metric within specification; wafer/die map coverage ≤90% of planned structures; design-rule and layout checks closed before tapeout.
Our team translates your technical objective into a controlled work package with the right tools, evidence, checkpoints, and acceptance criteria. You receive traceable results and a practical next-step recommendation rather than a generic assessment.
Engagements begin with the samples, architecture, process history, operating limits, and success metric you provide. We then confirm the test or engineering path, control measurement uncertainty, document dependencies and risks, and align the deliverables to the decision you need to make.
Catalogue reference: service PIC-024, source page 33.
| Service code | PIC-024 |
|---|---|
| Technical field | Photonic Integrated Circuits & Photonic Test |
| System under test | bump architecture; die-placement accuracy; solder or thermo-compression bonding; coplanarity assessment; underfill strategy; electrical continuity; optical alignment; thermal-path design |
| Software & instruments | FDTD/FEM photonic solvers; foundry PDK/GDS workflow; tunable laser; optical spectrum analyzer; wafer-level optical probe; 6-axis nanopositioning stages; active optical feedback |
| Required client inputs | PDK/foundry platform; wavelength and polarization targets; layout files or design objective; packaging and test constraints |
| Deliverables | simulation/layout package; test plan and measured data; design-to-test correlation; next-revision recommendations |
| Accuracy / target metrics | insertion/coupling loss budget met; spectral or RF metric within specification; wafer/die map coverage ≤90% of planned structures; design-rule and layout checks closed before tapeout |
| Lead discipline | Best staffed by a PIC designer / photonic test engineer |
Best staffed by a PIC designer / photonic test engineer. Engagement should begin with a one-page specification freeze, sample/data access plan, and acceptance-metric agreement. Avoid claiming production readiness until repeatability, measurement uncertainty, and process ownership are documented.
Share the objective, available samples or data, constraints, and acceptance target.
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