FA-002
Failure Analysis
PhotoBattery can define, execute, and validate this work as a measurable engineering engagement - from specification freeze and method selection through evidence review, acceptance testing, and decision-ready recommendations.
Semiconductor Process Yield Failure Analysis is a structured engineering service for organizations that need a defined technical answer, a validated process or test path, and evidence suitable for the next design, qualification, or investment decision. The work can address wafer-map review; process-traveler analysis; statistical failure clustering; critical-dimension inspection; thin-film metrology; electrical or optical testing. PhotoBattery selects and applies EBL or mask aligner; spin coater/developer; nanoimprint press if applicable; CD-SEM; overlay metrology; root-cause matrix, then evaluates the result against dominant root cause ranked with supporting evidence; corrective action tied to verification test; reference vs failed comparison completed; recurrence risk reduced by defined control.
Our team translates your technical objective into a controlled work package with the right tools, evidence, checkpoints, and acceptance criteria. You receive traceable results and a practical next-step recommendation rather than a generic assessment.
Engagements begin with the samples, architecture, process history, operating limits, and success metric you provide. We then confirm the test or engineering path, control measurement uncertainty, document dependencies and risks, and align the deliverables to the decision you need to make.
Catalogue reference: service FA-002, source page 96.
| Service code | FA-002 |
|---|---|
| Technical field | Failure Analysis |
| System under test | wafer-map review; process-traveler analysis; statistical failure clustering; critical-dimension inspection; thin-film metrology; electrical or optical testing; contamination investigation; cross-sectional analysis |
| Equipment & methods | EBL or mask aligner; spin coater/developer; nanoimprint press if applicable; CD-SEM; overlay metrology; root-cause matrix; cross-sectional inspection |
| Required client inputs | failed and reference samples; process traveler or service logs; symptom timeline; performance data before/after failure |
| Deliverables | evidence-based root-cause ranking; supporting images/data; corrective-action plan; verification test proposal |
| Accuracy / target metrics | dominant root cause ranked with supporting evidence; corrective action tied to verification test; reference vs failed comparison completed; recurrence risk reduced by defined control |
| Lead discipline | Best staffed by a failure analysis lead / process integration engineer |
Best staffed by a failure analysis lead / process integration engineer. Engagement should begin with a one-page specification freeze, sample/data access plan, and acceptance-metric agreement. Avoid claiming production readiness until repeatability, measurement uncertainty, and process ownership are documented.
Share the objective, available samples or data, constraints, and acceptance target.
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